The embedded SIM (eSIM) is a technology that integrates directly into the device’s motherboard using surface-mount technology and is fully encased within the device. Unlike traditional SIM cards, eSIMs cannot be easily removed, necessitating remote provisioning to select the SIM profile without physical changes. Introduced by the GSMA in March 2016, eSIM technology has become increasingly common in flagship devices since 2018, especially those that are not SIM locked. One typical form factor of eSIM is the MFF2, which measures approximately 6 mm x 5 mm, making it half the size of the smallest physical SIM card and allowing designers to optimize space for other functions. By 2025, it is anticipated that 98% of mobile network operators will support eSIMs.
Although often used interchangeably, eSIM and embedded Universal Integrated Circuit Card (eUICC) have distinct definitions; the eSIM refers to the hardware component that can be soldered into devices, while eUICC pertains to the software component that enables multiple network profiles to be managed Over-the-Air (OTA). The ICCID identifies profiles, and the eUICC-ID (EID) uniquely identifies the eSIM. eSIM technology is compatible with 5G networks. M2M (machine to machine) communication eSIMs are integrated at the manufacturing stage in devices like sensors and trackers, designed for environments where physical SIM replacements are impractical. The GSMA’s eSIM specifications cater specifically to the M2M market, where devices often have long lifespans or are in remote locations.
M2M eSIMs differ from consumer eSIMs, such as those used in smartphones and wearables, by employing a Push model for profile management via remote Subscription Manager servers, typically featuring preloaded profiles and enhanced security. M2M eSIMs follow the SGP.02 specifications, while consumer eSIMs adhere to SGP.22. The benefits of eSIM include immediate activation without a physical SIM and heightened security, making it harder for thieves to use stolen smartphones since eSIMs cannot be removed. The risk of damaging delicate SIM socket contacts is eliminated, and eSIMs offer cost efficiency and improved resilience against environmental factors like corrosion when compared to traditional SIM cards.
Mobile users can switch service providers without needing a new SIM, simplifying the mobile number portability (MNP) process. Additionally, eSIMs provide savings for international travelers, allowing them to connect with local telecom providers and avoid high roaming fees. eSIMs also enable telecom providers to extend their services into emerging sectors such as automotive, wearables, and consumer electronics, while reducing distribution costs associated with physical SIM cards. By minimizing plastic usage, eSIMs contribute to environmental sustainability. Recently, BSNL soft-launched its eSIM services in Tamil Nadu, joining Jio, Airtel, and Vodafone Idea in offering these capabilities. BSNL’s eSIM service allows customers to activate connections without a physical SIM on compatible devices, with plans for a nationwide rollout in phases.
Remote provisioning will be conducted via a secure QR code, and existing customers will have the option to migrate from physical to eSIM. The Department of Telecommunications sought recommendations from TRAI regarding the comprehensive deployment of eSIM in India, including mechanisms for switching profiles. TRAI provided its advice on March 21, emphasizing that all profiles on M2M eSIMs in imported devices should be reconfigured to Indian telecom profiles within six months of activation. The authority also highlighted the need for a standard process for transferring consumer eSIM profiles between devices, akin to the ease of switching physical SIMs. To ensure consumer convenience and prevent fraud, TRAI recommended that the government explore a standardized method for device-to-device profile transfers on eSIMs.
The future looks promising for BSNL’s eSIM services, with significant demand and a growing customer base, urging BSNL to ensure availability across all outlets.