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Odisha’s New Semiconductor Plant Marks a Major Advancement

sabal singh bhatibysabal singh bhati
02-11-2025, 12:10
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Odisha's New Semiconductor Plant Marks a Major Advancement

Bhubaneswar: SiCSem, a power electronics chip manufacturer, held a groundbreaking ceremony on Saturday for India’s first comprehensive silicon carbide semiconductor production facility, involving an investment of around Rs 2,000 crore. This integrated plant is anticipated to commence operations by 2027-28, with a processing capacity of 60,000 SiC wafers each year and the ability to package approximately 9.6 crore units. Union IT and Electronics Minister Ashwini Vaishnaw expressed through a video message, “Our aspiration to introduce advanced technology in Odisha is becoming a reality today, with a dedicated focus on fostering collaboration between industry and academia.” To this end, a partnership with IIT Bhubaneswar is underway to establish a semiconductor research lab.

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The minister noted that he recently authorized Rs 4.95 crore from the MPLAD fund for the NaMo Semiconductor Lab. Silicon carbide chips are essential for managing high voltage applications in products such as renewable energy systems, electric vehicles, and power inverters. Vaishnaw remarked that under Prime Minister Narendra Modi’s leadership, the electronics sector has expanded sixfold over the past 11 years, with India’s electronics exports rising eightfold in 12 years. “We are currently the third-largest exporter of electronic goods globally… I encourage the State government to actively pursue semiconductor industries. The Centre will support Odisha in all initiatives. Together, we can establish reforms and policies to advance this sector.

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Odisha should also develop a Data Centre policy, as major global industries are increasingly interested in establishing Data Centres in India,” he stated. Attendees at the event included Odisha Chief Minister Mohan Charan Majhi, State Electronics and IT Minister Mukesh Mahaling, and various senior state officials. Guru Thalapaneni, Managing Director of SiCSem Pvt Ltd, reiterated that the facility will process 60,000 SiC wafers annually and package around 9.6 crore units. The silicon carbide chip project by SiCSem, a subsidiary of Archean Chemical Industries, received Cabinet approval on August 12.

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